Laser manufacturing of microsieves for bioengineering applications

Authors

  • Mariusz Łapiński Military University of Technology
  • Zdzisław Bogdanowicz Military University of Technology
  • Jan Marczak Military University of Technology
  • Antoni Rycyk Military University of Technology
  • Antoni Sarzyński Military University of Technology
  • Marek Strzelec Military University of Technology

DOI:

https://doi.org/10.4302/photon.%20lett.%20pl.v7i3.583

Abstract

Laser drilling is a noncontact technology which allows high flexibility and full automation of the process. The research presented aimed at developing laser technology for manufacturing microsieves in thin Ni and Al foils. Involute and square distributions of holes were formed with an overall dimension of 3mm. Distance between adjacent holes was 25um to 100um, which meant fabrication of up to 10,000 openings per microsieve. Owing to optimisation of the optical system design and laser micromachining system parameters, holes with a desired diameter of around 12um were fabricated, limited only by diffraction divergence of laser beam.

Full Text: PDF

References
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Author Biographies

Mariusz Łapiński, Military University of Technology

Institute of Optoelectronics

Professor

Zdzisław Bogdanowicz, Military University of Technology

Faculty of Mechanical Engineering

Professor

Jan Marczak, Military University of Technology

Institute of Optoelectronics

Professor

Antoni Rycyk, Military University of Technology

Institute of Optoelectronics

assistant

Antoni Sarzyński, Military University of Technology

Institute of Optoelectronics

assistant professor

Marek Strzelec, Military University of Technology

Institute of Optoelectronics

assistant professor

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Published

2015-09-30

How to Cite

[1]
M. Łapiński, Z. Bogdanowicz, J. Marczak, A. Rycyk, A. Sarzyński, and M. Strzelec, “Laser manufacturing of microsieves for bioengineering applications”, Photonics Lett. Pol., vol. 7, no. 3, pp. pp. 60–62, Sep. 2015.

Issue

Vol. 7 No. 3 (2015)

Section

Articles

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